演講快訊

2022
09.23

Semiconductor supply chain and the challenging

劉惠強 副總裁

時間：2022年09月23日 (五) 15:10
主持人：許蘇文 教授
講者：劉惠強 副總裁
服務單位：萬有半導體 (Alpha and Omega Semiconductor)
講題：Semiconductor supply chain and the challenging
地點：93456

摘要 :

Semiconductor supply chains are very complex starting from circuit design, raw materials, equipment, manufacturing, assembly & test to integrated devices and combining other related components, board, etc. to form finished Integrated Circuities (IC) consumer products, before distributing and transporting to end customers. These complex supply chains are subjected to the risks of supply due to natural disaster, trade-conflict, pandemics, war, and geopolitical reasons. The trending of semiconductor industry in the past 20 yrs will be presented. Case study of complexity of supply chain and supply chain risk management will also be discussed.

學經歷 :

學歷

  • 國立成功大學, 化工學士 (National Cheng Kung University, Chemical Engineering, BS, 1987)
  • 美國德州大學奧斯汀分校,化工碩士 (University of Texas at Austin, Chemical Engineering, MS, 1991)

        。研究半導體的製程

  • 美國德州大學奧斯汀分校,化工博士 (University of Texas at Austin, Chemical Engineering, Ph.D, 1996)

        。研究半導體封測和新絕緣材料

  • 密西根州立大學, 商學院, 企管碩士 (Michigan State University at East Lansing, MBA, 2000)

        。供應鏈管理 


經歷

1. 美國道康寧公司 (Dow Corning) : 半導體材料部門, 應用專家(1996-2000), Application Specialist, Semiconductor Fab Materials, Dow Corning (1996-2000)

  • 低介電常數的新絕緣材料研究

 2. 美國珀金埃爾默公司 (Perkin Elmer): 光電部, 光刻模塊經理， (2000), Photolithography module manager, Optoelectronics, Perkin Elmer (2000)

  • X-Ray 面板顯示檢測器生產

 3. 英特爾公司 (Intel Corporation): 半導體晶圓材料運營部, 高級工程師, 高級商務/項目經理（2000-2009), Staff Engineer, Sr. Commodity/Program Manager, Fab Materials Operations, Intel    Corporation (2000-2009)

  • 擔任90奈米先進絕緣材料的選擇及在新半導體製程 (90nm/65nm) 的導入工作, 供應鏈和供應商的管理, 英特爾大連半導體晶圓廠Fab 68晶圓製造材料供應鏈建立的負責人.

 4. 美國日能 (SunPower) ,設備採購部高級部經理 (2009/2013),  Sr. Capital Equipment     Procurement Department Manager, SunPower (2009/2013)

  • 在菲律賓和馬來西亞設立太陽能生產線, 太陽能設備供應鏈和供應商的管理

 5. 美國美信 (Maxim Integrated), 半導體晶圓廠採購執行總監 (2013-2017), Executive Director, Fab Procurement, Maxim Integrated (2013-2017)

  • 管理美國四個半導體晶圓工廠的生產供應鏈, 在美國所有上市的半導體公司中,絕無僅有的華人高層之一.

6. 美國應用材料 (Applied Materials), 全球運營部, 供應鏈/供應商總監2017-2019）Supply Chain/Supplier Director, Worldwide Operation, Applied Materials (2017-2019)

  • 先進的半導體特別的設備供應鏈建立供應鏈和供應商的管理

 7. 美國萬有半導體 (Alpha and Omega Semiconductor), 全球採購副總裁（2019 年至今), VP of WW Procurement, Alpha and Omega Semiconductor (2019-Current)

  • 帶領萬國半導體的採購供應鏈團隊。主管美國八吋的晶圓廠、上海兩個封裝測試工廠、及重慶萬國12吋晶圓廠和封裝工廠的採購供應鏈.採購的團隊進行組織改造、建立新的流程跟制度、招聘有經驗的員工、重新打造一個學習及創造高價值的採購團隊、進而每年幫公司節省了不少花費及成本的下降。

 

傑出成就獲獎情形

  • Best Student poster paper in Packaging Science, Techcon 1993 (hosted by Semiconductor Research company, a US semiconductor research consortium)
  • Dow Corning Employee Performance Award (1996/1999)
  • Intel Materials Achievement Award, Intel TME Achievement Award, Intel Operation Excellence Award, Intel Quality Award
  • SunPower Employment Achievement Prism Award and SunPower Key Employee Award (top 1% performer)
  • CFO STAR Excellent Award 2016, Maxim Integrated
  • 2021年成大北加州校友會傑出校友獎

 

美國專利

9 US granted patents;

PAT. NO.                                  Title

1. 8,513,111      Forming semiconductor structures

2. 7,867,687      Methods and compositions for reducing line wide roughness

3. 7,469,443      Brush for cleaning wafer

4. 7,391,501      Immersion liquids with siloxane polymer for immersion lithography

5. 7,303,985      Zeolite-carbon doped oxide composite low k dielectric

6 7,125,793       Method for forming an opening for an interconnect structure in a dielectric layer having a photosensitive material

7. 7,071,125      Precursors for film formation

8. 6,995,073      Air gap integration

9. 6,864,192      Langmuir-Blodgett chemically amplified photoresist

 

會議和期刊論文發表

Published > 35 journal papers and conference proceedings

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